PCAP Optical Bonding Embedded BOND

OPEN FRAME TOUCH

  • Tecnologia: PCAP Optical Bonding
  • Versione: Embedded
  • Serie: BOND
10,1"/ 13,3"/ 15,6"/ 21,5"*/ 23,6"/ 27"/ 32"*/ 43"*/ 49"/ 55"
* Industrial Panel Available
La nuova serie WTD di open frame touch denominata BOND in tecnologia Optical Bonding, consente impieghi in condizioni ambientali estreme.

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Descrizione

Embedded BOND Series
LOCA Optical Bonding Process
-30°+80° (105 TNI) Operating S.
-35°+85° Storage System